Optical Fiber Cable Exhibition 2024 Industry News: Market Growth Driven by IoT Device Sales
Optical Fiber Cable Exhibition 2024 learned the data showing that from 2024 to 2028, the market size for Semiconductor Assembly and Testing Services (SATS) is expected to increase by USD 19.31 billion. According to data from Technavio, the global market for Semiconductor Assembly and Testing Services (SATS) is forecasted to grow by USD 19.31 billion from 2024 to 2028, fueled by the rising sales of IoT devices. The market is set to progress with a Compound Annual Growth Rate (CAGR) of 6.59% during this period.
Optical Fiber Cable Exhibition 2024 has noted that significant developments in chip packaging technologies have substantially propelled the SATS market. One of the standout innovations is the 3D IC packaging, which facilitates the stacking of miniaturized ICs and smart centers, effectively addressing spatial limitations. This technology is also popular due to its cost-effectiveness.
Another notable technology is the Through-Silicon Via (TSV) or silicon interconnect, which is utilized in manufacturing 3D packaging and integrated circuits. This enhances the compression ratio, performance, and volumetric efficiency of circuits. TSV technology is also employed in Complementary Metal-Oxide-Semiconductor (CMOS) image sensors, eliminating lead bonding and establishing high-density interconnects. These factors are expected to significantly contribute to the global expansion of the SATS market in the coming years.
The Semiconductor Assembly and Testing Services (SATS) market is facing several challenges in today's technological landscape. The emergence of 3D semiconductor components and the implementation of 5G technology in communication and computing sectors have escalated the demand for advanced packaging technologies.
Key application areas for these technologies include the communications industry and the automotive electronics sector. In these fields, semiconductors, chip designs, and chipsets (ICs) are heavily utilized. The manufacturing of semiconductors in wafer fabrication plants must adapt to market demands to ensure the reliability of 5G technology, 5G wireless networks, and accelerated stress testing.
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